Blog Post Image: Made in IBM Labs: IBM Scientists Unveil Highly Integrated Millimeter-Wave Transceiver for Mobile Communications and Radar Imaging applications

IBM researchers debut high-frequency wireless chip fabricated using IBM SiGe BiCMOS technology. Fully integrated phased array IC. 6.7mm X 6.7mm. Fabricated in IBM SiGe BiCMOS technology. The IC integrates 32 receive and 16 transmit elements with dual outputs to support 16 dual polarized antennas. Image credit: IBM